• Show Sidebar

Jest 5250 produktów.

Sortuj wg:
Best sellers Dostępne Nazwa, A do Z Nazwa, Z do A Cena, rosnąco Cena, malejąco
Pokazano 1177-1188 z 5250 pozycji

Aktywne filtry

wishlist
Compare
Quickview

Realizacja RTL8411AS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001276
3,45 €

Realizacja RTL8411AS

wishlist
Compare
Quickview

QDFX350

QD-FX-350MT-N-A3

Part Number QD-FX-350MT-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0952

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001277
21,33 €

QD-350MT-N-A3

wishlist
Compare
Quickview

USBSC09F FX1S1N2U

Model:USB-SC09-FX

Brand:AMSAMOTION

Length:2.5Meters

Interface : USB-Round 8Pin

Purpose:USB-SC09-FX,Suitable Mitsubishi FX1S/1N/2N/3U/3G ect...FX series PLC programming cable, Round 8pin port.

CH001280
12,43 €

USBSC09FX dla Mitsubishi PLC (ang.) Program Cable FX1S/1N/2N/3U

wishlist
Compare
Quickview

N3350 SR2Z7 Stencil Template 90x90 (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001281
9,82 €

N3350 stencil

wishlist
Compare
Quickview

IDT 92HD80B1X5NLG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001282
3,45 €

IDT 92HD80B1X5NLG

wishlist
Compare
Quickview

25 DVD EEPROM Flash BIOS USB z programistą Software Driver

CH341A 24 25 Series DVD EEPROM Flash BIOS USB Programmer with Software Driver MA

Product Details:

USB Programmer

Condition: New

Special USB chip CH341A production, check speed about 2-3 mbit per minute

Support WIN 98, WINME, WIN2K, WINXP, VISTA, WIN7-32 system

Using USB port power supply

Support chip list

AMIC:

A25L05P,A25L10P,A25L20P,A25L40P,A25L80P,A25L16P

ATMEL:

AT25DF041A,AT25DF321,AT25F004,AT25F512A,AT25F2048,AT25F4096,AT25F1024A,AT25FS010,AT25FS040,AT26DF081A,

AT26DF161A,AT26DF321,AT26F004

EON:

EN25B05,EN25P05,EN25B10,EN25P10,EN25BF20,EN25P20,EN25F20,EN25B40,EN25P40,EN25F40,EN25B80,

EN25P80,EN25F80,EN25T80,EN25B16,EN25P16,EN25B32,EN25P32,EN25B64,EN25P64

Excel Semiconductor Inc.

ES25P10,ES25P20,ES25P40??ES25P80,ES25P16,ES25P32

ST:

M25P05A,M25P10A,M25P20,M25P40,M25P80,M25P16,M25P32,M25P64,M25PE10,M25PE20,M25PE40,

M25PE80,M25PE16,M25PE32,M45PE10,M45PE20,M45PE40,M45PE80,M45PE16,M45PE32

MXIC:

MX25L512,MX25L1005,MX25L2005,MX25L4005,MX25L8005,MX25L1605,MX25L3205,MX25L6405 MX25L6445,MX25L6405(SOP16)

NexFlash:

NX25P80,NX25P16,NX25P32

Chingis Technology Corporation

Pm25LV512,Pm25LV010,Pm25LV020,Pm25LV040,Pm25LV080,Pm25LV016,Pm25LV032,Pm25LV064

Saifun Semiconductors

SA25F005,SA25F010,SA25F020,SA25F040,SA25F080,SA25F160,SA25F320,

WINBOND:

W25P10,W25X10,W25Q10,W25P20,W25X20,W25Q20,W25P40,W25X40,W25Q40,W25P80,W25X80,W25Q80,

W25P16, W25X16,W25Q16,W25P32,W25X32,W25Q32,W25P64,W25X64,W25Q64

8 pin serial BIOS chips can erase, can read and write

Color is shown as pictures

PLS NOTE that due to lighting effects, monitor's brightness/ contrass settings ect, there could be some slight differences in the color tone of the pictures and the actual item!

Package Included:

1 x USB Programmer

CH001283
3,23 €

25 DVD EEPROM Flash BIOS USB z programistą Software Driver

wishlist
Compare
Quickview

BROADCOM BCM57785XB0KGML

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001284
3,45 €

BROADCOM BCM57785XB0KGML

wishlist
Compare
Quickview

G73VZ

G73-VZA-N-A2

Part Number G73-VZA-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1018

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001286
24,62 €

G73VZA-N-A2

wishlist
Compare
Quickview

TPS61180

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001287
3,97 €

TPS61180

Realizacja RTL8411AS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001276
3,45 €

Realizacja RTL8411AS

wishlist
Compare

QDFX350

QD-FX-350MT-N-A3

Part Number QD-FX-350MT-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0952

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001277
21,33 €

QD-350MT-N-A3

wishlist
Compare

USBSC09F FX1S1N2U

Model:USB-SC09-FX

Brand:AMSAMOTION

Length:2.5Meters

Interface : USB-Round 8Pin

Purpose:USB-SC09-FX,Suitable Mitsubishi FX1S/1N/2N/3U/3G ect...FX series PLC programming cable, Round 8pin port.

CH001280
12,43 €

USBSC09FX dla Mitsubishi PLC (ang.) Program Cable FX1S/1N/2N/3U

wishlist
Compare

N3350 SR2Z7 Stencil Template 90x90 (ang.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001281
9,82 €

N3350 stencil

wishlist
Compare

IDT 92HD80B1X5NLG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001282
3,45 €

IDT 92HD80B1X5NLG

wishlist
Compare

25 DVD EEPROM Flash BIOS USB z programistą Software Driver

CH341A 24 25 Series DVD EEPROM Flash BIOS USB Programmer with Software Driver MA

Product Details:

USB Programmer

Condition: New

Special USB chip CH341A production, check speed about 2-3 mbit per minute

Support WIN 98, WINME, WIN2K, WINXP, VISTA, WIN7-32 system

Using USB port power supply

Support chip list

AMIC:

A25L05P,A25L10P,A25L20P,A25L40P,A25L80P,A25L16P

ATMEL:

AT25DF041A,AT25DF321,AT25F004,AT25F512A,AT25F2048,AT25F4096,AT25F1024A,AT25FS010,AT25FS040,AT26DF081A,

AT26DF161A,AT26DF321,AT26F004

EON:

EN25B05,EN25P05,EN25B10,EN25P10,EN25BF20,EN25P20,EN25F20,EN25B40,EN25P40,EN25F40,EN25B80,

EN25P80,EN25F80,EN25T80,EN25B16,EN25P16,EN25B32,EN25P32,EN25B64,EN25P64

Excel Semiconductor Inc.

ES25P10,ES25P20,ES25P40??ES25P80,ES25P16,ES25P32

ST:

M25P05A,M25P10A,M25P20,M25P40,M25P80,M25P16,M25P32,M25P64,M25PE10,M25PE20,M25PE40,

M25PE80,M25PE16,M25PE32,M45PE10,M45PE20,M45PE40,M45PE80,M45PE16,M45PE32

MXIC:

MX25L512,MX25L1005,MX25L2005,MX25L4005,MX25L8005,MX25L1605,MX25L3205,MX25L6405 MX25L6445,MX25L6405(SOP16)

NexFlash:

NX25P80,NX25P16,NX25P32

Chingis Technology Corporation

Pm25LV512,Pm25LV010,Pm25LV020,Pm25LV040,Pm25LV080,Pm25LV016,Pm25LV032,Pm25LV064

Saifun Semiconductors

SA25F005,SA25F010,SA25F020,SA25F040,SA25F080,SA25F160,SA25F320,

WINBOND:

W25P10,W25X10,W25Q10,W25P20,W25X20,W25Q20,W25P40,W25X40,W25Q40,W25P80,W25X80,W25Q80,

W25P16, W25X16,W25Q16,W25P32,W25X32,W25Q32,W25P64,W25X64,W25Q64

8 pin serial BIOS chips can erase, can read and write

Color is shown as pictures

PLS NOTE that due to lighting effects, monitor's brightness/ contrass settings ect, there could be some slight differences in the color tone of the pictures and the actual item!

Package Included:

1 x USB Programmer

CH001283
3,23 €

25 DVD EEPROM Flash BIOS USB z programistą Software Driver

wishlist
Compare

BROADCOM BCM57785XB0KGML

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001284
3,45 €

BROADCOM BCM57785XB0KGML

wishlist
Compare

G73VZ

G73-VZA-N-A2

Part Number G73-VZA-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1018

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001286
24,62 €

G73VZA-N-A2

wishlist
Compare

TPS61180

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001287
3,97 €

TPS61180

wishlist
Compare
Back to top