Dom

*ASUS S200E parts: LCD panel

*ASUS S200E parts: Battery c21-x202 used 5136mAh 38Wh 7,4V

*ASUS S200E parts: Touchpad board

IN STOCK

As you know you can flashing many kinds of bios for Macbook. 

 With this Profesional SET you can to make adjustments for SAM , clearing ME, apple icloud clearing , apple bios password clearing .

This SET (RT809For TL866II you can select) used for Macbook, MacBook Air and new MacBook Pro models from 2010 to 2017 

It has three connectors for the years 2010 – 2011, 2012 – 2014 and 2015 – 2017

You can read bios chip without desoldering process. 

PLEASE TO SELECT ONE SET 

New programmer RT809F + WSOP + SAM EFI J6100+J6100+J5100 cable  / Tested 100% . 

New programmer TL866II + WSOP + SAM EFI J6100+J6100+J5100 cable  / Tested 100% . 

FOR GIFT DATA LIST for Apple Mackbook schematics + board files. (280-300 files) 

 In package include: 

1 pcs Programmer RT809F or TL866II ( You must to select)

1 pcs USB Connection cable 

1 SPI SAM EFI cable J6100+J6100+J5100

1) USER MANUAL

1) WSOP Adapters (  8x6mm + 6x5mm)

1) Schematics

Important Information

If some SPI programmer doesn't work, you need to supply +3.3V to 'PP3V3_SUS' of the Mainboard.

As mentioned that, you must supply +3.3V to the 'PP3V3_SUS' of the Mainboard using a DC power supply.

Sample +3.3 Volt connection pins are described in the  manual.

Shipping details:
Fast shipping: Second day after received payment.

Europe:  5 -14 days. Other countries: more than 14 days.

Our working time: 8.00 - 12.00AM, 13.00-17.00 PM

Worldwide Shipping  à  by DHL , TNT, DPD

GK208-302-B1

Part Number GK208-302-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1606

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

W pakiecie znajdują się:

1 szt. -KABEL SILIKONOWY JTAG SOIC8 DIP ZE ZŁOTYMI 8 PINAMI

Możesz wybrać opcję wysyłki w kasie:

Ekonomiczna: 10-35 dni roboczych (Europa i cały świat)

Przyspieszone: 5-10 dni roboczych (Europa i cały świat)

Specyfikacja:

SOIC 8pin, 208mm, 1,27mm

Stal nierdzewna 25VF064C

Szerokość wióra: 5.18-5.38mm

Długość chipa: 7.08-7.34mm

----------------------------------------

VSOP 8pin, 208mm, 1,27mm

Winbonda W25Q32FV

Szerokość wióra (E1): 5.18-5.28mm

Długość wióra (D): 5.18-5.28mm

----------------------------------------

Możesz użyć KABLA SILIKONOWEGO GOLD PIN i przeczytać ten chip bios (odwiedź nasz sklep i sprawdź)

Apple Macbook Pro A1286 M98_820-2330-A_G96-632-C1_SST25VF032B- obsługuje silikonowy kabel ze ZŁOTYM pinem

Apple A1278 K6 MCP89MZ-A2 SST25VF032B-  Kabel taśmowy EFI nie jest kompatybilny (obsługuje tylko kabel silikonowy ZŁOTY PIN)

Apple Imac 27 A1312 820-2828-A_MX25L6406E– Kabel taśmowy EFI nie jest kompatybilny (obsługuje tylko kabel silikonowy ZŁOTY PIN)

Apple Macbook Air A1370 820-2855-A MX25L6406D

Apple A1370 820-2855-A MX25L6406D

Apple Macbook Air A1370 820-2855-A MX25L6406D

Apple A1502 051-0052 820-3536 MX25L6406E

Apple MacBook Pro A1297 820-2914-B-MX25L6406E-  (obsługuje tylko kabel silikonowy ZŁOTY PIN)

Apple MacBook Pro A1278-820-2936-B-MXIC MX25L6406E- (obsługuje tylko kabel silikonowy ZŁOTY PIN)

Apple A1466 820-3209-A Apple MX25L6406E-1.820-3209-A

Apple MacBook Air A1369 2011-820-3023-A-MX25L6406E

Apple MacBook Air 11" 2012 A1465 820-3208-A 2012 MX25L6406E

Apple MacBook Pro Retina 13" A1425 820-3462-A 2012 Rok MX25L6406E

Apple MacBook Pro 13" A1278 820-3115-B MD101 MX25L6406E- (obsługuje tylko kabel silikonowy ZŁOTY PIN)

Apple MacBook Pro Retina 13" A1502 koniec 2013 połowa 2014 820-3476-A 4G 8G MX25L6406E

Apple MacBook Air 11" A1465 820-3435-A 13"A1466 820-3437-A 2013 2014 2015 MX25L6406E

Apple A1502 051-0052 820-3536 MX25L6406E

Apple MAC Mini A1347 820-3228-A mx25l6406E

Apple MacBook Air 11" 2012 A1465 820-3208-A 2012 MX25L6406E

Apple MacBook Air 11" A1465 820-3435-A 13"A1466 820-3437-A 2013 2014 2015 MX25L6406E

----------------------------------------

Informacje dla klienta / Información para el cliente:
jeśli nie pochodzisz z Europy, zapytaj o podatek celny, VAT swojego kraju.
Nie wysyłamy produktów do Rosji.
Kolumbia, Paragwaj, Brazylia, Meksyk, Peru – przed złożeniem zamówienia prosimy zapytać swoich celników o podatki i cła.
Kolumbia, Paragwaj, Brazylia, Meksyk, Peru - realizar un pedido, konsultuj się z aduana sobre la cantidad de impuestos y aranceles.
Si no eres de Europa, Consulta sobre el impuesto de aduanas, el IVA de tu país.

»» Pobierz oprogramowanie RT809H «

»» Obsługiwana lista układów scalonych «

Obsługiwana lista układów scalonych:

chipsetpro.com/supported-ic-list/RT809H-Device-List.txt

W pakiecie zawarte:

1 szt. Programator RT809H
1 szt. Kabel USB
1 szt. Kabel taśmowy EFI Hirose 12pin Hirose30pin molex30pin

W kasie możesz wybrać opcję wysyłki: ekonomiczna lub przyspieszona 

Ekonomiczna: 10-35 dni roboczych (Europa i cały świat)

Przyspieszone: 5-10 dni roboczych (Europa i cały świat)

Złącze SAM stosowane jest w modelach Macbook, Macbook Air, Macbook Pro. na lata 2010-2017. 

Za pomocą tego profesjonalnego kabla możesz dokonać regulacji dotyczących SAM, czyszczenia regionu ME, hasła EFI, kasowania hasła dysku SSD, blokady Pad-Lock, uszkodzonego oprogramowania sprzętowego, zablokowanego trybu rozruchu, uszkodzonego silnika zarządzania, MDM, zablokowanego konta w chmurze, czyszczenia chmury, hasła oprogramowania sprzętowego, hasło alfanumeryczne, kasowanie hasła bios, inne korekty biosu ręcznie. 

Ten SET (kabel taśmowy RT809H  EFI) używany w modelach Macbook, MACBook Air i MACBook Pro od 2010 do 2017 roku 

Posiada trzy złącza J6100, J6100, J5100 na lata 2010 – 2011, 2012 – 2014 i 2015 – 2017

216-0857001

Part Number 216-0857001 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N12P-LP-A1 GT540M

Part Number N12P-LP-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1341

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

EM1200GBB22GV E1-1200

Part Number EM1200GBB22GV Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 360 Description Original new

EM1200GBB22GV E1-1200 Processor for Laptop AMD E1 BGA413 1.4 GHz CPU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

DH82Z97 SR1JJ

Part Number DH82Z97 SR1JJ Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

GL82HM175 SR30W

Part Number GL82HM175 SR30W Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N16E-GT-A1 GTX970M

Part Number N16E-GT-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 105 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

216-0856040

Part Number 216-0856040 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 2009

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock