Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH002721
Na razie nie dodano żadnej recenzji.
16 other products in the same category
80 modeli 2000pc 1206 SMD muRata GRM31 Kit
Brands: Chipsetpro.com
64,97 €
80 modeli 2000pc 1206 SMD muRata GRM31 Kit
RICHTEK RT8068A 13 DFN10 33mm
Brands: Chipsetpro.com
3,45 €
RICHTEK RT8068A (13) DFN-10 (3*3mm) (ang.)
SIS 962UA
