X810480-003 XBOX360
Part Number X810480-003 Manufacturer Microsoft
BGA Alloy No Pb/Lead Free Date Code 10+
Package/Case 1 PCS Description Bulk new
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH005180
Na razie nie dodano żadnej recenzji.
16 other products in the same category
170 Models 8500pcs RC0805 SMD FR07 (ang.) Kit
Brands: Chipsetpro.com
49,09 €
170 Models 8500pcs RC0805 SMD FR-07 Series YAGEO Resistor 1% Accuracy Sample Book Assortment Kit
X810480-003 XBOX3
