Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH001034
Na razie nie dodano żadnej recenzji.
16 other products in the same category
TU102300AK5A1 TU102400A1 TU102875A1 TU102300A1 Stencil Template 90x9001 (ang.)
Brands: Chipsetpro.com
9,97 €
TU102-300A-K5-A1 TU102-400-A1 TU102-875-A1 TU102-300A-K1-A1 Stencil Template 90*90*90
ODNX02A2 Stencil Solder Station Kits (ang.)
Brands: Chipsetpro.com
36,67 €
ODNX02-A2 Stencil Solder Station Kits (ang.)
G86-303 stencil
