SR3RZ Stencil Solder Station Kits (ang.)
SR3RZ Stencil Solder Station Kits (ang.)
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
SR3RZ Stencil Solder Station Kits (ang.)
SR170 Stencil Template 90*90 (ang.)
SR177 SR1J SR173 SR173 SR175 SR176 SR178 SR179 Stencil Template 90*90 (ang.)
BGA96 U3100 CD3215A CD3215C00 CD3215B01 CD3215B03 templariusz