Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
25Q64, LM36272 36273 36274 BGA24 Stencil Template (ang.)
BD82H77 SLJ88 Stencil Template (ang.)
GP104-400-A1 Stencil Template 90*90 (ang.)
I7-2637M SR0D3 Stencil Template (ang.)
GL82CM236 SR2CE Stencil Template 90*90 (ang.)
N13M-GE1-S-A1 Stencil Template
