Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH001541
Na razie nie dodano żadnej recenzji.
16 other products in the same category
J2900 SR1SB Stencil Template (ang.)
Brands: Chipsetpro.com
6,22 €
J2900 SR1SB Stencil Template (ang.)
E31505M SR2FN Stencil Template (ang.)
Brands: Chipsetpro.com
6,84 €
E3-1505M SR2FN Stencil Template (ang.)
Obsługa stacji BGA Solder Magnet90
Brands: Chipsetpro.com
65,00 €
ZQT-90X BGA Reballing Station 80*80 90*90 Stencils Reballing Station BGA Solder Station (ang.)
4405Y SR2ER Stencil Template (ang.)
Brands: Chipsetpro.com
8,70 €
4405Y SR2ER Stencil Template (ang.)
i76820HK SR2FL (ang.) stencil
Brands: Chipsetpro.com
9,50 €
I7-6820HK SR2FL Stencil Template 90*90 (ang.)
SR2ZW Stencil Template (ang.)
