Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH001581
Na razie nie dodano żadnej recenzji.
16 other products in the same category
SONY PS4 CXD90025G (ANG.) templariusz
Brands: Chipsetpro.com
5,59 €
SONY PS4 CXD90025G (ANG.) templariusz
sR1Q0 Stencil Template 90x90 (ang.)
Brands: Chipsetpro.com
9,52 €
I5-4210H SR1Q0 Stencil Template 90*90 (ang.)
3955U SR2EW Stencil Template (ang.)
Brands: Chipsetpro.com
4,35 €
3955U SR2EW Stencil Template (ang.)
telefon 6 PLUS Stencil Template (ang.)
Brands: Chipsetpro.com
5,72 €
Telefon 6 PLUS Stencil Template (ang.)
SRCKB SRCUU SRD1V SREJP SREJQ SREJR SRF6X SRFFX SRFFZ SRGKW 8265U templariusz
