Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
SONY PS4 CXD90026AG Stencil Template (ang.)
SR17C SR17D SR17D SR13J SR13H DH82H86 DH82H82HM87 stencil
J2900 SR1SB Stencil Template (ang.)
J4205 SR2ZA Stencil Template (ang.)
GL51256 GL064 GL032 BGA64 Stencil Template 90*90 (ang.)
G96-975 templariusz
