Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
16 other products in the same category
i33110M SR0N1 Stencil Template 90x90x (ang.)
I3-3110M SR0N1 Stencil Template 90*90 (ang.)
GL82Z170 Stencil Template 90x90 (ang.)
GL82Z170 Stencil Template 90*90 (ang.)
i76820HK SR2FL (ang.) stencil
I7-6820HK SR2FL Stencil Template 90*90 (ang.)
2160728016 Stencil Template 90x90 (ang.)
216-0728016 Stencil Template 9090 (ang.)
sR2ZW Stencil Template 90x90 (ang.)
SR2ZW Stencil Template 90*90 (ang.)
i56300U SR2F0 Stencil Template 90x90 (ang.)
SR2F0 Stencil Template 90*90 (ang.)
sR3LC Stencil Template 90x90 (ang.)
SR3LC Stencil Template 90*90 (ang.)