Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
G86-630-A2 G86-631-A2 GF-GO7400T-N-A3 N10M-GE1-S N10M-GE2
SR177 SR1J SR173 SR175 SR176 SR178 SR179 templariusz
I5-2467M SR0D6 Stencil Template 90*90 (ang.)
2160810028 stencil
