Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
16 other products in the same category
SR3RZ Stencil Solder Station Kits (ang.)
SR3RZ Stencil Solder Station Kits (ang.)
telefon 6 PLUS Stencil Template (ang.)
Telefon 6 PLUS Stencil Template (ang.)
AM5000IBJ44HM AM5200IAJ44HM templariusz
AM5000IBJ44HM AM5200IAJ44HM templariusz
TU102300AK5A1 TU102400A1 TU102875A1 TU102300AK1A1 templariusz
TU102-300A-K5-A1 TU102-400-A1 TU102-875-A1 TU102-300A1 Stencil Template (ang.)
215088 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 0
2150880004 templariusz