N2807 SR1W5 Stencil Template
Part Number intel CPU Stencil Manufacturer ATK
Stencil Template Direct heating Metal 304 Stainless steel
Package/Case 1 PCS Description Buik new
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH002302
Na razie nie dodano żadnej recenzji.
16 other products in the same category
N3540 SR1YW Stencil Template (ang.)
Brands: Chipsetpro.com
6,22 €
N3540 SR1YW Stencil Template (ang.)
LGA52 LGA60 LGA70 NAND Stencil Template PC (ang.) templariusz
Brands: Chipsetpro.com
9,82 €
LGA52 LGA60 LGA70 NAND Stencil Template PC (ang.) templariusz
i34030U SR1EN Stencil Template (ang.)
Brands: Chipsetpro.com
5,47 €
I3-4030U SR1EN Stencil Template (ang.)
N2807 SR1W5 templariusz
