Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH002362
Na razie nie dodano żadnej recenzji.
16 other products in the same category
N2805 SR1LY Stencil Template (ang.)
Brands: Chipsetpro.com
6,22 €
N2805 SR1LY Stencil Template (ang.)
GP102350K5A1 Stencil Template (ang.)
Brands: Chipsetpro.com
6,22 €
GP102-350-K5-A1 Stencil Template (ang.)
3270M SR0DR Stencil Template (ang.)
Brands: Chipsetpro.com
5,40 €
I3-2370M SR0DR Stencil Template (ang.)
47pcs Stencil Direct Heat for GAMES Stencil Template (ang.)
Brands: Chipsetpro.com
39,66 €
47pcs Stencil Direct Heat for GAMES Stencil Template (ang.)
SR3RZ Stencil Solder Station Kits (ang.)
Brands: Chipsetpro.com
36,67 €
SR3RZ Stencil Solder Station Kits (ang.)
sR0N9 Stencil Template 90x90 (ang.)
Brands: Chipsetpro.com
9,97 €
SR0N9 Stencil Template 90*90 (ang.)
215-0767003 templariusz
