Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
ZQT-90X BGA Reballing Station 80*80 90*90 Stencils Reballing Station BGA Solder Station (ang.)
6in1 MSM8953 MSM8937 MSM899898 SDM450
J1900 SR1UT Stencil Template (ang.)
SR3LC Stencil Template 90*90 (ang.)
I33110M QC4V templariusz
