Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
Pentium Dual-Core Mobile 987 (ang.) templariusz
SR3L9 Stencil Template 90*90 (ang.)
E3-1505M SR2FN Stencil Template (ang.)
SR1EF Stencil Template 90*90 (ang.)
SR17C SR17D SR17D SR13J SR13H DH82H86 DH82H82HM87 templariusz
E3-1505M SR2FN Stencil Template 90*90 (ang.)
218-0697010 templariusz
