Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
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ZQT-90X BGA Reballing Station 80*80 90*90 Stencils Reballing Station BGA Solder Station (ang.)
BGA96 BGA100 BGA132 BGA132 BGA152 BGA152 BGA272 BGA316 2246XT 2258XT AS225858585858XT AS225858585858
N16V-GM-B1 Stencil Template
