Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH003441
Na razie nie dodano żadnej recenzji.
16 other products in the same category
sR2KA Stencil Template 90x90x90 (ang.)
Brands: Chipsetpro.com
9,96 €
SR2KA Stencil Template 90*90 (ang.)
i54300U SR1ED Stencil Template (ang.)
Brands: Chipsetpro.com
5,47 €
i5-4300U SR1ED Stencil Template (ang.)
Samsung Exynos8895 templariusz
Brands: Chipsetpro.com
8,70 €
Samsung Exynos8895/MSM8998/S8+ templariusz
i73517U SR0N6 Stencil Template 90x90 (ang.)
Brands: Chipsetpro.com
9,97 €
I7-3517U SR0N6 Stencil Template 90*90 (ang.)
N16V-GM-B1 Stencil Template
