Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
16 other products in the same category
BD82HM76 SLJ8E Stencil Template 90x90x90 (ang.)
Brands: Chipsetpro.com
9,96 €
BD82HM76 SLJ8E Stencil Template 90*90 (ang.)
GL82CM236 SR2CE Stencil Template 90x90x90 (ang.)
Brands: Chipsetpro.com
9,97 €
GL82CM236 SR2CE Stencil Template 90*90 (ang.)
N3710 SR2KL Stencil Template (ang.)
Brands: Chipsetpro.com
6,22 €
N3710 SR2KL Stencil Template (ang.)
SR2W8 Stencil Template 90x90x90 (ang.)
Brands: Chipsetpro.com
9,97 €
SR2W8 Stencil Template 90*90 (ang.)