Obsługa stacji BGA Solder Magnet90

65,00 €
Netto

ZQT-90X BGA Reballing Station 80*80 90*90 Stencils Reballing Station BGA Solder Station (ang.)

Chipsetpro.com

Chipsetpro.com

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Buy Chip Repair Tool: * B&R 43in1 Chip Repair Tool Set CPU Scraper Removal Chip

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

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CH000067
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Obsługa stacji BGA Solder Magnet90

ZQT-90X BGA Reballing Station 80*80 90*90 Stencils Reballing Station BGA Solder Station (ang.)

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