sR3LC Stencil Template 90x90 (ang.)
SR3LC Stencil Template 90*90 (ang.)
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
SR3LC Stencil Template 90*90 (ang.)
SONY PS4 CXD90026G (ANG.) templariusz
N2820 SR1SG Stencil Template (ang.)
BD82HM65 SLH9D Stencil Template (ang.)
I3-2377M SR0CW Stencil Template 90*90 (ang.)
3855U SR2EV Stencil Template 90*90 (ang.)