Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH004140
Na razie nie dodano żadnej recenzji.
16 other products in the same category
3955U SR2EW Stencil Template (ang.)
Brands: Chipsetpro.com
4,35 €
3955U SR2EW Stencil Template (ang.)
sR170 Stencil Template 90x90 (ang.)
Brands: Chipsetpro.com
9,96 €
SR170 Stencil Template 90*90 (ang.)
SONY PS4 CXD90025G (ANG.) templariusz
Brands: Chipsetpro.com
5,59 €
SONY PS4 CXD90025G (ANG.) templariusz
i57200U SR342 Template 90x90 (ang.)
Brands: Chipsetpro.com
9,96 €
I5-7200U SR342 Stencil Template 90*90 (ang.)
J2900 SR1SB Stencil Template (ang.)
Brands: Chipsetpro.com
6,22 €
J2900 SR1SB Stencil Template (ang.)
Samsung Exynos7904J720A305G887 templariusz
Brands: Chipsetpro.com
8,58 €
Samsung Exynos7904/J720/A305/G887/A40S/A8S/A8S/A8S/A8S/A305/G887/A40S/A40S/A8S/A8S/A8S/A8S/J720/A305/A305/G887/G887/A40S/A40S/A40S/A8S/A8S/A8S/A8S/A8S/A8S/A8S/S/S/A8S/A30S/A30S/A30S/A305/A30S/A30S/A30S/A/A/A30S/A30S/A/A30S/A305/A/A30S/A30S/A30S/A/A305/A30S/A305/A305/A30S/A/A/A/A/A/A/A/A305/A40S/A40S/A templariusz
GP104-140-A1 Stencil Template (ang.)
