Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH000455
Na razie nie dodano żadnej recenzji.
16 other products in the same category
i33110M SR0N1 Stencil Template (ang.)
Brands: Chipsetpro.com
5,40 €
I3-3110M SR0N1 Stencil Template (ang.)
Pentium Dual Core Mobile SR0FB Stencil Template (ang.)
Brands: Chipsetpro.com
5,40 €
Oficjalna strona Pentium Dual-Core Mobile
IT8586VG IT8587VG IT8517VG IT858518VG Stencil Template (ang.)
Brands: Chipsetpro.com
7,46 €
IT8586VG IT8587VG IT8517VG IT858518VG Stencil Template (ang.)
GL82Z170 Stencil Template 90x90 (ang.)
Brands: Chipsetpro.com
9,96 €
GL82Z170 Stencil Template 90*90 (ang.)
sR0DQ Stencil Template 90x90M (ang.)
Brands: Chipsetpro.com
9,97 €
SR0DQ Stencil Template 90*90 (ang.)
BD82H77 SLJ88 Stencil Template (ang.)
