Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
TU102-300A-K5-A1 TU102-400-A1 TU102-875-A1 TU102-300A1 Stencil Template (ang.)
I3-2375M SR0U4 Stencil Template 90*90 (ang.)
GP102-350-K5-A1 Stencil Template (ang.)
SR1YJ Stencil Solder Station Kits (ang.)
Celeron Dual-Core SR08N Stencil Template 90*90 (ang.)
E3-1535M Stencil Template 90*90 (ang.)
215-0669049 templariusz
