Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH004497
Na razie nie dodano żadnej recenzji.
16 other products in the same category
SR071 Stencil Solder Station Kits (ang.)
Brands: Chipsetpro.com
36,67 €
SR071 Stencil Solder Station Kits (ang.)
N34506 Stencil Template 90x90 (ang.)
Brands: Chipsetpro.com
9,82 €
N34506 Stencil Template 90*90 (ang.)
sR2EU Stencil Template 90x90 (ang.)
Brands: Chipsetpro.com
9,96 €
SR2EU Stencil Template 90*90 (ang.)
SR177 SR1J SR173 SR175 SR176 SR178 SR179 templariusz
Brands: Chipsetpro.com
5,40 €
SR177 SR1J SR173 SR175 SR176 SR178 SR179 templariusz
FH82CM246 stencil
