Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH004643
Na razie nie dodano żadnej recenzji.
16 other products in the same category
i32375M SR0U4 Stencil Template (ang.)
Brands: Chipsetpro.com
5,40 €
I3-2375M SR0U4 Stencil Template (ang.)
SR17C SR17D SR17D SR13J SR13H DH82H86 DH82H82HM87 templariusz
Brands: Chipsetpro.com
5,40 €
SR17C SR17D SR17D SR13J SR13H DH82H86 DH82H82HM87 templariusz
Obsługa stacji BGA Solder Magnet90
Brands: Chipsetpro.com
65,00 €
ZQT-90X BGA Reballing Station 80*80 90*90 Stencils Reballing Station BGA Solder Station (ang.)
N10M-GE1-S Stencil Template (ang.)
