Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH004645
Na razie nie dodano żadnej recenzji.
16 other products in the same category
SR0V4 Stencil Template 90x90x90 (ang.)
Brands: Chipsetpro.com
17,14 €
SR0V4 Stencil Template 90*90 (ang.)
Pentium DualCore (ang.) Mobile Stencil Template 90x90x
Brands: Chipsetpro.com
17,14 €
Pentium Dual-Core Mobile Stencil Template 90*90 (ang.)
215088 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 0
Brands: Chipsetpro.com
7,46 €
2150880004 templariusz
SR2EYSR366 Stencil Solder Station Kits (ang.)
Brands: Chipsetpro.com
43,14 €
SR2EY/SR366 Stencil Solder Station Kits (ang.)
N3510 SR1LV Stencil Template (ang.)
Brands: Chipsetpro.com
6,22 €
N3510 SR1LV Stencil Template (ang.)
LE82GL960 SLA5V (ANG.) templariusz
