J1900 SR1UT Stencil Template
Part Number intel CPU Stencil Manufacturer ATK
Stencil Template Direct heating Metal 304 Stainless steel
Package/Case 1 PCS Description Buik new
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH004651
Na razie nie dodano żadnej recenzji.
16 other products in the same category
SRCKB SRCUU SRD1V SREJP SREJQ SREJR SRF6X SRFFX SRFFZ SRGKW 8265U Stencil Template 90x90x
Brands: Chipsetpro.com
23,00 €
SRCKB SRCUU SRD1V SREJP SREJQ SREJR SRF6X SRFFX SRFFZ SRGKW 8265U Stencil Template 90*90
Pentium DualCore (ang.) Mobile Stencil Template 90x90x
Brands: Chipsetpro.com
17,14 €
Pentium Dual-Core Mobile Stencil Template 90*90 (ang.)
J1900 SR1UT Stencil Template (ang.)
