Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH004653
Na razie nie dodano żadnej recenzji.
16 other products in the same category
SR3RZ Stencil Solder Station Kits (ang.)
Brands: Chipsetpro.com
36,67 €
SR3RZ Stencil Solder Station Kits (ang.)
N3510 SR1LV Stencil Template (ang.)
Brands: Chipsetpro.com
6,22 €
N3510 SR1LV Stencil Template (ang.)
J4205 SR2ZA Stencil Template 90x90 (ang.)
Brands: Chipsetpro.com
9,82 €
J4205 SR2ZA Stencil Template 90*90 (ang.)
SONY PS4 CXD90026G (ANG.) templariusz
Brands: Chipsetpro.com
5,40 €
SONY PS4 CXD90026G (ANG.) templariusz
341pc 90x90mm Stencil TemplateBGA (ang.) Stacja Solder Station
Brands: Chipsetpro.com
217,56 €
341pc 90mm Stencil Template+BGA (ang.) Stacja Solder Station
GK110-400B1 Stencil Template
