Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH004711
Na razie nie dodano żadnej recenzji.
16 other products in the same category
sR2FR Stencil Template 90x90x (ang.)
Brands: Chipsetpro.com
9,50 €
I3-6100H SR2FR Stencil Template 90*90 (ang.)
215088 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 0
Brands: Chipsetpro.com
7,46 €
2150880004 templariusz
BD82HM75 SLJ8F Stencil Template 90x90x90 (ang.)
Brands: Chipsetpro.com
9,97 €
BD82HM75 SLJ8F stencil
FW82801 templariusz
