Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH004820
Na razie nie dodano żadnej recenzji.
16 other products in the same category
11pc ifon 5 ifon X Stenc
Brands: Chipsetpro.com
19,89 €
11pcs iphone5 – iphoneX Stencil Template (ang.)
YM2200C4T20FB YM2300C4T4MFB YM2500C4T4T4MFB templariusz
Brands: Chipsetpro.com
6,22 €
YM2200C4T20FB YM2300C4T4MFB YM2500C4T4T4MFB templariusz
i33110M SR0N2 Stencil Template 90x90x
Brands: Chipsetpro.com
9,97 €
I3-3110M SR0N2 Stencil Template 90*90 (ang.)
GF-GO7300
