![](https://www.chipsetpro.com/722-large_default/gm107400a2-templariusz.jpg)
![](https://www.chipsetpro.com/722-large_default/gm107400a2-templariusz.jpg)
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
BGA96 U3100 CD3215A CD3215C00 CD3215B01 CD3215B03 templariusz
I3-2377M SR0CW Stencil Template 90*90 (ang.)
I7-3517U SR0N6 Stencil Template 90*90 (ang.)
GP106-750-A1 Stencil Template 90*90 (ang.)
NH820801GBM SL8YB Stencil Template (ang.)