sR1Q0 Stencil Template 90x90 (ang.)
I5-4210H SR1Q0 Stencil Template 90*90 (ang.)
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
I5-4210H SR1Q0 Stencil Template 90*90 (ang.)
I3-2370M SR0DR Stencil Template (ang.)
I3-4005U SR1EK Stencil Template (ang.)
GP102-350-K1-A1 Stencil Template (ang.)
BD82H77 SLJ88 Stencil Template (ang.)
Pentium Dual-Core Mobile SR0V5 Stencil Template (ang.)
25Q64, LM36272 36273 36274 BGA24 Stencil Template (ang.)