Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH005102
Na razie nie dodano żadnej recenzji.
16 other products in the same category
Samsung Exynos8895 templariusz
Brands: Chipsetpro.com
8,70 €
Samsung Exynos8895/MSM8998/S8+ templariusz
12in1 BGA199 BGA130 BGA149 BGA149 BGA202 BGA202 BGA137 BGA137 BGA130 BGA149 BGA149 BGA202 templariusz
Brands: Chipsetpro.com
9,82 €
12in1 BGA199 BGA130 BGA149 BGA149 BGA202 BGA202 BGA137 BGA137 BGA130 BGA149 BGA149 BGA202 templariusz
215-08988 mroźniki Stencil Template 9090 (ang.)
