Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH005184
Na razie nie dodano żadnej recenzji.
16 other products in the same category
N12EGTA1 Stencil Template 90x90x90x
Brands: Chipsetpro.com
9,96 €
N12E-GT-A1 Stencil Template 90 (ang.)
E31535M SR2FM Stencil Template (ang.)
Brands: Chipsetpro.com
6,84 €
E3-1535M SR2FM Stencil Template (ang.)
SR072 Stencil Template 90x90 (ang.)
Brands: Chipsetpro.com
17,14 €
SR072 Stencil Template 90*90 (ang.)
Samsung Exynos9820SM8150S10NI templariusz
Brands: Chipsetpro.com
8,58 €
Samsung Exynos9820/SM8150/S10+ templariusz
N17EESA1 Stencil Template 90x90 (ang.)
Brands: Chipsetpro.com
9,96 €
N17E-ES-A1 Stencil Template 90 (ang.)
GK106-240-A1 Stencil Template 9090 (ang.)
