Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH005251
Na razie nie dodano żadnej recenzji.
16 other products in the same category
EMMCEMCPUFSFon BGA1531621691862212545425 Strona oficjalna
Brands: Chipsetpro.com
47,12 €
EMMC/EMCP/UFS/Font BGA153/162/169/186/221/254 Strona oficjalna
BD82HM67 SLJ4N Stencil Template 90x90x90
Brands: Chipsetpro.com
17,14 €
BD82HM67 SLJ4N Stencil Template 90*90 (ang.)
215088 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 000 0
Brands: Chipsetpro.com
7,46 €
2150880004 templariusz
LE82P31 Stencil Template (ang.)
