Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH000539
Na razie nie dodano żadnej recenzji.
16 other products in the same category
i33110M SR0T4 Stencil Template (ang.)
Brands: Chipsetpro.com
5,40 €
I3-3110M SR0T4 Stencil Template (ang.)
TU102300AK5A1 TU102400A1 TU102875A1 TU102300AK1A1 templariusz
Brands: Chipsetpro.com
7,46 €
TU102-300A-K5-A1 TU102-400-A1 TU102-875-A1 TU102-300A1 Stencil Template (ang.)
i76820HK SR2FL (ang.) stencil
Brands: Chipsetpro.com
9,50 €
I7-6820HK SR2FL Stencil Template 90*90 (ang.)
Pentium DualCore Mobile 987 (ang.) templariusz
Brands: Chipsetpro.com
5,40 €
Pentium Dual-Core Mobile 987 (ang.) templariusz
i73632QM SR0UZ Stencil Template (ang.)
Brands: Chipsetpro.com
5,40 €
I7-3632QM SR0UZ Stencil Template (ang.)
LGA52 LGA60 LGA70 NAND Stencil Template PC (ang.) templariusz
Brands: Chipsetpro.com
9,82 €
LGA52 LGA60 LGA70 NAND Stencil Template PC (ang.) templariusz
N13P-GLR-A1 Stencil Template (ang.)
