Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
16 other products in the same category
Pentium DualCore Mobile 987 (ang.) templariusz
Pentium Dual-Core Mobile 987 (ang.) templariusz
BD82HM77 SLJ8C Stencil Template (ang.)
BD82HM77 SLJ8C Stencil Template (ang.)
54210U SR1EF Stencil Template 90x90 (ang.)
SR1EF Stencil Template 90*90 (ang.)
sR341 Stencil Template 90x90 (ang.)
SR341 Stencil Template 90*90 (ang.)
i32365M SR0U3 Stencil Template (ang.)
I3-2365M SR0U3 Stencil Template (ang.)
AM5000IBJ44HM AM5200IAJ44HM templariusz
AM5000IBJ44HM AM5200IAJ44HM templariusz