Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH000931
Na razie nie dodano żadnej recenzji.
16 other products in the same category
i32365M SR0U3 Stencil Template (ang.)
Brands: Chipsetpro.com
5,40 €
I3-2365M SR0U3 Stencil Template (ang.)
Samsung Exynos8895 templariusz
Brands: Chipsetpro.com
8,70 €
Samsung Exynos8895/MSM8998/S8+ templariusz
sR3L9 Stencil Template 90x90 (ang.)
Brands: Chipsetpro.com
17,14 €
SR3L9 Stencil Template 90*90 (ang.)
I5-4210H SR1Q0 Stencil Template 90*90 (ang.)
