Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH000986
Na razie nie dodano żadnej recenzji.
16 other products in the same category
i33110M SR0T4 Stencil Template 90x90x (ang.)
Brands: Chipsetpro.com
17,14 €
I3-3110M SR0T4 Stencil Template 90*90 (ang.)
A1707 A1706 339S00056 SR2NH H67388 SN650839 (ANG.) templariusz
Brands: Chipsetpro.com
8,70 €
A1707 A1706 339S00056 SR2NH H67388 SN650839 (ANG.) templariusz
GL82Q150 SR2C6 (ANG.) templariusz
