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Jest 5073 produktów.

110 ml Oficjalna strona Mobile Phone

Description:

100% brand new and high quality

Repair rubber dock bumpers

Seal plastic containers

Repair stripped threads in wood

Specation:

Material: plastic shell + glue

Color: as pic shows

Length: approx. 6.69inch/17cm

Width: approx. 2.36inch/6cm

Model: B-7000

Net weight: 3.7fl.oz (110ml)

Solid content: 30% - 35%

After curing Hardness: 65-80A

Surface drying time: 3 minutes

Full cure time: 24-48 hours

Storage: stored at 10 degrees to 28 degrees

Method of use:

Please read carefully before using the product instruction

Large area before use, please do small area test

Please make sure that the sticking surface cleaning and drying

The best use of temperature should be between 18-32 degrees

The product after opening the cover please timely cover titch removal for the adhesive residue on the cover

Wait for 1-2 minutes , two adherend aligment bonding a little pressure

It is straight hours can be after 48 hours to achieve the best bonding strength

The product does not use the bottle cap to prevent glue after contacting air curing

Package included:

1x Strength Glue

CH004821
Brands: Chipsetpro.com

Chipsetpro.com

Chipsetpro.com

6,09 €

110ml Multifunctional Adhesive Glue B-7000 For Mobile Phone Universal (ang.)

11pc ifon 5 ifon X Stenc

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004810
Brands: Chipsetpro.com

Chipsetpro.com

Chipsetpro.com

19,89 €

11pcs iphone5 – iphoneX Stencil Template (ang.)

12 15 mm15 mm Heatsink Thermal Pad Copper Shim for Laptop CPU GPU Copper Plate Plate (ang.)

100% Brand new and high quality

The copper has high purity coefficient of thermal conductivity as high as 407 w/ (m?K)

With this copper pad to greatly lower GPU temperatures, can be used for graphics, northbridge, CPU chips.

It can be applied to HP, Dell, Acer, Thinkpad and all laptop and computer heatsink solution!

Material: Copper

Color: As the picture

Size: Approx. 1.2T x 15 x 15(T*L*W)

How to use: First daub a little thermal silicone grease (FYI: Do not use the low-end silicone grease), then put the right size copper shims, then daub a little thermal silicone grease again, last install the heatsink and tighten the screws

CH000747
Brands: Chipsetpro.com

Chipsetpro.com

Chipsetpro.com

2,70 €

1.2 15mm*15mm Heatsink Thermal Pad Copper Shim for Laptop CPU GPU Copper Plate Plate Plate Plate Plate (ang.)

120pc DuPont Cable Jumper 20cm 254mm MaleMale MaleFemale (ang.)

Buy DuPont cable jumper: * Male-Male Male-Female Female-Female

Brand new and high quality.

3lot 40P Color Jumper Cable Dupont Line, it contains 120pcs jumper cables in total.

Length : 20cm

1p-1p pin header

A row of 40 root

Compatible with 2.54mm spacing pin headers

Package Included:

40pcs DuPont line of male-to-female

40pcs DuPont line of male-to-male

40pcs DuPont line of female-to-female

CH003487
Brands: Chipsetpro.com

Chipsetpro.com

Chipsetpro.com

5,90 €

120pc DuPont Cable Jumper 20cm 2.54mm Male-Male Male-Female (ang.)

12704 Adapter SOP16DIP8

Product Description

Package includes: 1PCS X SOP16- DIP8 Socket (300mil)

SOP16- DIP8 adapter (300mil) will work on all programmers

Stock: in stock

Condition: NEW

CH003743
Brands: Chipsetpro.com

Chipsetpro.com

Chipsetpro.com

4,85 €

Adapter SOP16-DIP8 (300mil) (ang.)

12704 Adapter SOP28D

Product Description

Package includes: 1PCS X SOIC28-DIP28 (300mil) Socket

SOIC28-DIP28 (300mil) adapter will work on all programmers

Stock: in stock

Condition: NEW

CH005095
Brands: Chipsetpro.com

Chipsetpro.com

Chipsetpro.com

5,35 €

Adapter SOP28-DIP28 (300mil) (ang.)

12in1 BGA199 BGA130 BGA149 BGA149 BGA202 BGA202 BGA137 BGA137 BGA130 BGA149 BGA149 BGA202 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001240
Brands: Chipsetpro.com

Chipsetpro.com

Chipsetpro.com

9,82 €

12in1 BGA199 BGA130 BGA149 BGA149 BGA202 BGA202 BGA137 BGA137 BGA130 BGA149 BGA149 BGA202 templariusz

110 ml Oficjalna strona Mobile Phone

Description:

100% brand new and high quality

Repair rubber dock bumpers

Seal plastic containers

Repair stripped threads in wood

Specation:

Material: plastic shell + glue

Color: as pic shows

Length: approx. 6.69inch/17cm

Width: approx. 2.36inch/6cm

Model: B-7000

Net weight: 3.7fl.oz (110ml)

Solid content: 30% - 35%

After curing Hardness: 65-80A

Surface drying time: 3 minutes

Full cure time: 24-48 hours

Storage: stored at 10 degrees to 28 degrees

Method of use:

Please read carefully before using the product instruction

Large area before use, please do small area test

Please make sure that the sticking surface cleaning and drying

The best use of temperature should be between 18-32 degrees

The product after opening the cover please timely cover titch removal for the adhesive residue on the cover

Wait for 1-2 minutes , two adherend aligment bonding a little pressure

It is straight hours can be after 48 hours to achieve the best bonding strength

The product does not use the bottle cap to prevent glue after contacting air curing

Package included:

1x Strength Glue

CH004821

Chipsetpro.com

Chipsetpro.com

6,09 €

110ml Multifunctional Adhesive Glue B-7000 For Mobile Phone Universal (ang.)

11pc ifon 5 ifon X Stenc

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004810

Chipsetpro.com

Chipsetpro.com

19,89 €

11pcs iphone5 – iphoneX Stencil Template (ang.)

12 15 mm15 mm Heatsink Thermal Pad Copper Shim for Laptop CPU GPU Copper Plate Plate (ang.)

100% Brand new and high quality

The copper has high purity coefficient of thermal conductivity as high as 407 w/ (m?K)

With this copper pad to greatly lower GPU temperatures, can be used for graphics, northbridge, CPU chips.

It can be applied to HP, Dell, Acer, Thinkpad and all laptop and computer heatsink solution!

Material: Copper

Color: As the picture

Size: Approx. 1.2T x 15 x 15(T*L*W)

How to use: First daub a little thermal silicone grease (FYI: Do not use the low-end silicone grease), then put the right size copper shims, then daub a little thermal silicone grease again, last install the heatsink and tighten the screws

CH000747

Chipsetpro.com

Chipsetpro.com

2,70 €

1.2 15mm*15mm Heatsink Thermal Pad Copper Shim for Laptop CPU GPU Copper Plate Plate Plate Plate Plate (ang.)

120pc DuPont Cable Jumper 20cm 254mm MaleMale MaleFemale (ang.)

Buy DuPont cable jumper: * Male-Male Male-Female Female-Female

Brand new and high quality.

3lot 40P Color Jumper Cable Dupont Line, it contains 120pcs jumper cables in total.

Length : 20cm

1p-1p pin header

A row of 40 root

Compatible with 2.54mm spacing pin headers

Package Included:

40pcs DuPont line of male-to-female

40pcs DuPont line of male-to-male

40pcs DuPont line of female-to-female

CH003487

Chipsetpro.com

Chipsetpro.com

5,90 €

120pc DuPont Cable Jumper 20cm 2.54mm Male-Male Male-Female (ang.)

12704 Adapter SOP16DIP8

Product Description

Package includes: 1PCS X SOP16- DIP8 Socket (300mil)

SOP16- DIP8 adapter (300mil) will work on all programmers

Stock: in stock

Condition: NEW

CH003743

Chipsetpro.com

Chipsetpro.com

4,85 €

Adapter SOP16-DIP8 (300mil) (ang.)

12704 Adapter SOP28D

Product Description

Package includes: 1PCS X SOIC28-DIP28 (300mil) Socket

SOIC28-DIP28 (300mil) adapter will work on all programmers

Stock: in stock

Condition: NEW

CH005095

Chipsetpro.com

Chipsetpro.com

5,35 €

Adapter SOP28-DIP28 (300mil) (ang.)

12in1 BGA199 BGA130 BGA149 BGA149 BGA202 BGA202 BGA137 BGA137 BGA130 BGA149 BGA149 BGA202 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001240

Chipsetpro.com

Chipsetpro.com

9,82 €

12in1 BGA199 BGA130 BGA149 BGA149 BGA202 BGA202 BGA137 BGA137 BGA130 BGA149 BGA149 BGA202 templariusz