25K Qwin 0.40mm BGA Leaded Solder Balls
Part Number 0.40mm BGA Leaded Solder Balls Manufacturer Qwin
BGA Alloy Sn63/Pb37 Date Code 19+
Package/Case 25K Description Original new
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
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25Kwin 0,40 mm BGA Oficjalna strona Solder Balls
