25K Qwin 040mm BGA Leading Solder Balls (ang.)

3,11 €
Netto

25Kwin 0,40 mm BGA Oficjalna strona Solder Balls

Chipsetpro.com

Chipsetpro.com

Ilość
Obecnie brak na stanie

25K Qwin 0.40mm BGA Leaded Solder Balls

Part Number 0.40mm BGA Leaded Solder Balls Manufacturer Qwin

BGA Alloy Sn63/Pb37 Date Code 19+

Package/Case 25K Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001078

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25K Qwin 040mm BGA Leading Solder Balls (ang.)

25Kwin 0,40 mm BGA Oficjalna strona Solder Balls

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