

250K PMTC 0.35mm BGA No Pb/Lead Free Solder Balls
Part Number 0.35mm BGA Solder Balls Manufacturer PMTC
BGA Alloy No Pb/Lead Free Date Code 19+
Package/Case 250K Description Brand New
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
Honton HT-1212 (ang.) Współczynnik stałej temperatury spalinowej 110V
Bateria Sony VAIO VGP-BPS13 (11.1V 4400mAh) (ang.)
1.2 15mm*15mm Heatsink Thermal Pad Copper Shim for Laptop CPU GPU Copper Plate Plate Plate Plate Plate (ang.)
15mm – 33m Kapton (ang.) Tape High Temperature Heat Resistant Polyimide (ang.)
TOSHIBA C650 C660 C655 C655D L650D L650D L655 L670 L675 L750 L755
25 mm Kapton Tape High Temperature Heat Resistant Polyimide (ang.)
LVDS Cable for screen Dell 3521 p/n: DC020022P000005JWND (ang.)
30 mm Kapton Tape High Temperature Heat Resistant Polyimide (ang.)
6 Port 6A Auto Detect USB (ang.) Oficjalna strona internetowa linii kolejowej Display
LVDS Cable for screen Lenovo G460 G465 Z465 Z465 P/N: DC02000ZM10 1BB9PL050E6 (ang.)
PZEM-031 4in1 Multifunction DC 6,5~100V 20A
TMS91429CT Nowe Transformer dla SAMSUNG 943NW 953BW
Halnziye HY910-50ml Thermal Glue (ang.)
LVDS Cable for screen Lenovo G50-45 G50-70 G50-70 Z50-70 Z50-45 Ver.1 (ang.)