Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
Silicone Heat Mat Repair (ang.) Tablice Fones Fix Pad 460 300 mm
LVDS Cable for screen Lenovo G580 G585 G480 V.2 P/N: DC02001ES10 (ang.)
900M-T-K KINGBOX 936 bez lutowni
LVDS Cable dla ekranu Asus X453MA F453M p/n: DD0XK1LC000 14005-01250000 14005-012502002
LVDS Cable for screen HP 15-f 15-n p/n: DD0U86LC000 DD0U86LC010 DD0U86LC020 DD0U86LC0U86LC030 732004
LVDS Cable dla ekranu Asus X550 R510DP EDP 30 pin p/n: 1422-01M6000000000000 DP: 1422-01M6000000000 DP: 1422-01M6000
Andonstar ADSM201 HDMI 1080 Digital Microscope Repair
PS-20A Digital Ultrasonic Cleaner Stainless Steel Heater Timer Industrial Grade 3.2L (ang.)
1.0 15mm*15mm Heatsink Thermal Pad Copper Shim dla procesora Laptop GPU Copper Plate
1000X Wireless WiFi Digital Electron Microscope Supports Apple IOS Android System (ang.)
7pc VETUS ESD Safe Anti-Static Stainless Steel Tweezers Set Maintenance Repair Tools (ang.)
220 60W Simple metal Soldering iron Stand (ang.)
Foxcon INTEL i7 PC LGA1366 CPU BGA Socket Base Connector (ang.)
10G Japan goot 10 BGA (ang.) Odpoczynek Flux
