Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
50 mm Kapton Tape High Temperature Heat Resistant Polyimide (ang.)
DUE R3 Board SAM3X8E 32bit ARM Cortex-M3 Control Module + USB8E Cable for Arduino (ang.)
QIANLI-007 Chip Repair Tool Set CPU Scraper (ang.)
Foxcon Laptop Motherboard 754 Baza BGA (ang.)
110V 60W Simple metal Soldering iron Stand (ang.)
56 LED Light Boom PCB Repair Soldering
LVDS Cable for screen HP CQ60 G60 16 LCD P/N: 50.4AH15.001 50.4AH16.001 496841-001
LVDS Cable for screen Acer ES1-512 ES1-531 ES1-571 p/n: 450.03704.0001 453704.0011 450.03704.
MSI GTX 750 760 770 780 Twin Frozr Video Card PLD10010S12H B
Bateria dla MSI GT685R CR720 GT60 GT70 GX60 (11.1V 7800mAh) PN: BTY-GS70 BTY-M6D
Aluminium Foil Tape 100 mm Roll Ideal For Heat Reflection (ang.)
T13C4 Ba Kon zintegrowany rdzeniowo-przewodnikowy o stałej temperaturze 75W
Reball Soldering Flux Injection Putter (ang.)
Foxcon Socket LGA2011-V3 CPU Strona BGA baza danych
Teensy 3.2 MK20DX256 – chlebowa tablica rozwojowa z ładunkiem funkcji
Laptop Motherboard Baza BGA
