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PCE16 4PN03 USB 30 PCIE 1X TO 16X Okładka
PCE16 4P-N03 USB 3.0 PCI-E 1X Okładka
Foxconn H4 Socket LGA1151 CPU Base 1151 PC Connector BGA Base
Part Number LGA1151 Socket Manufacturer Foxconn
BGA Alloy No Pb/Lead Free Socket type BGA1150
Package/Case 1 PCS Description Brand New
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
PCE16 4P-N03 USB 3.0 PCI-E 1X Okładka
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Aluminium Foil Tape 30 mm Roll Ideal For Heat Reflection (ang.)
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2,5 mm Blue GPU procesor Heatsink Silicone Compound Thermal Conductive Pad
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