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Microscope 144 LED (ang.) Ring Light Illuminator (ang.)
Microscope 144 LED (ang.) Ring Light Illuminator (ang.)
Foxconn INTEL i7 PC LGA1366 CPU BGA Socket Base Connector
Part Number LGA1366 Manufacturer Foxconn
BGA Alloy No Pb/Lead Free Socket type BGA1366
Package/Case 1 PCS Description Original new
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
Microscope 144 LED (ang.) Ring Light Illuminator (ang.)
2,5 mm Blue GPU procesor Heatsink Silicone Compound Thermal Conductive Pad
800pc Anti-Static ESD Rubber Finger Cot Protector Cover (ang.)
WQ-52D AOYUE Soldering Iron Lead Free Type (ang.)
25 mm Kapton Tape High Temperature Heat Resistant Polyimide (ang.)
M402SD07G VFD MODULE M402SD07GK M402SD07GS M402SD07J M402SD07
220V/110V 800W dla gorącej stacji BGA, Honton R390 R392 R490 R490 R590
T13-J02 BaKon zintegrował ogrzewanie rdzenia bezprzewodowego o stałej temperaturze 75W
LVDS Cable for screen Lenovo G770 G780 p/n DC020017D10 (ang.)
0,5 15mm*15mm Heatsink Thermal Pad Copper Shim dla procesora Laptop GPU Copper Plate
UNO R3 ATmega328P CH340 Mini USB Strona internetowa Compatible-Arduino FF
Reball Soldering Flux Injection Putter (ang.)
LVDS Cable for screen Lenovo Yoga 11e P/N: DDLI5ALC000 DDLI5ALC010 DDLI5ALC020 (ang.)
CP-2015 Goot Wick Desoldering (ang.)
Honton HT-R260 (ang.) Współczynnik stałej temperatury