Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
OFICJALNA STRONA Wielokrotny kierowca śrubowy Household, Mobile phone i obsługa komputerów
LVDS Cable for screen Dell 3521 p/n: DC020022P000005JWND (ang.)
LVDS Cable for screen Samsung NP300E5C NP300E5Z NP305E5A p/n: BA39-01166A (ang.)
11# SATA Hard Disk Power Line Transfer Line 4 pinIDE to serial Connection Line
Bateria dla HP Compaq 550 610 615 6730s 6735s 6820s 6830s (10,8V 5200mAh) HSTNN-IB62 HSTNN-OB6 (ang.)
Lenov C540 All In One Hard drive HDD SATA Cable DC02001 Okładka
Titanium Alloy Advanced polarized Glasses Smudge Guard Sunglasses-Advanced 100% UV (ang.)
3# SATA Hard Disk Power Line Transfer Line 4 pinIDE to serial Connection Line
PS-08A Digital Ultrasonic Cleaner Stainless Steel Heater Timer Industrial Grade 1.3L (ang.)
LVDS Cable for screen Lenovo Y470 P/N: DC020017610 (ang.)
Bateria Sony SVT-14 SVT-15 (11,4V 3760mAh) VGP-BPS33-15 (ang.)
Silicone Heat Mat Repair (ang.) Tablice Fones Fix Pad 460 300 mm
PS-80A Digital Ultrasonic Cleaner Stainless Steel Heater Timer Industrial Grade 22L (ang.)
ESP8266 ESP-12E UART WIFI Wireless Shield Development Board (ang.)
CP-1515 Goot Wick Desoldering (ang.)
