Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
40PCS DuPont Cable Jumper 20cm 2.54 mm Male-Female-Female
Weller LT1L TIP Round 0,2 MM WSP80 Sillver Series (ang.)
TOSHIBA C650 C660 C655 C655D L650D L650D L655 L670 L675 L750 L755
LVDS Cable for screen Lenovo G560 Z560 P/N: DC02000ZL10 DC02000ZI10 (ang.)
Aluminium Foil Tape 50mm Roll Ideal For Heat Reflection (ang.)
CM141 Lead-Free Titanium Alloy Soldering Pot Desoldering Bath 900W 220V (ang.)
LVDS Cable for screen Dell 3541 5542 7542 p/n: 45000H01.0001 0FKGC9
1.0m OMEGA K-TYPE Thermocouple TT-K-30-SLE
LVDS Cable for screen Asus K56 A56 S56 p/n: 1422-019W000 14005-00600000 14005000000000000000000100
Bateria dla Samsunga R425 R428 R430 R520 (11.1V 7800mAh) AA-PB9NC5B AA-P96B AA-PNC6W
ESP8266 ESP-12E UART WIFI Wireless Shield Development Board (ang.)
Bulb ELP67 for EB-SXW12/EB-W02/EB-W12/EB-X02/EB-X11/EB-X14 Projector (ang.)
0,3 15mm*15mm Heatsink Thermal Pad Copper Shim for Laptop CPU GPU Copper Plate (ang.)
Bateria Sony VAIO VGP-BPS13 (11.1V 4400mAh) (ang.)
53in1 multi-Purpose Precision Screwdriver Set – HUIJIAQI No.8921 (ang.)
DF40C-50DS-0.4V(51) Socket Connector 50P
CP-1515 Goot Wick Desoldering (ang.)
