
Foxcon H3 Socket LGA1155 baza danych
Foxcon H3 Socket LGA1155 baza danych
Product description:
1. Excellent heating material, digital temperature control meter and digital time system, stable and reliable humidity control
2. It can observe the melting of BGA Solder beads in real time and eliminate the interference of environmental factors
3. Axial fan cooling to ensure the safe temperature of the box
4. The bottom of the aluminum alloy plate is heated, with high temperature accuracy and small fluctuation, causing damage to the absolute BGA chip
5. BGA chips of different specifications can be welded at the same time
6. Sound alarm function after welding
Main specifications:
1. Heating area: 120mm * 200mm
2. Power: 600W
3. Temperature setting: adjustable from room temperature to 350 ?, PID controlled
4. Timing time: 0.1-9.9 minutes
5. Working voltage: AC220V, other voltages are optional
6. Boundary dimension: 310mm * 280mm * 145mm (L * w * h)
7. Weight: about 8.1kg
Na razie nie dodano żadnej recenzji.
Foxcon H3 Socket LGA1155 baza danych
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