Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
DP832 Kanał DC Power Supply 3 Channel (ang.)
PZEM-021 4in1 (ang.) Oficjalna strona KWh Watt Panel
VETUS ESD-13 Safe Anti-Static Stainless Steel Tweezers (ang.)
2,5 mm Blue GPU procesor Heatsink Silicone Compound Thermal Conductive Pad
Cool Fan for Toshiba Satellite M500 U500 (ang.)
Aluminium Foil Tape 100 mm Roll Ideal For Heat Reflection (ang.)
LVDS Cable for screen Asus K42 X42 P/N: 1422-00P1000 1422-00P4000 1422-00P9000 1422-00SK000 1422-00SK000 14G22100200VV 1422-00P4000 1422-00P9000 1422-00SK000 1422-00SK000 1400SK000 14G22100200VVVD
5# SATA Hard Disk Power Line Transfer Line 4 – pinIDE dla linii SATA
FPC Socket Connector for ASUS X555 A555 K555 K590 Y583 R556 X55 HDD 50pin
Bateria Sony SVT-14 SVT-15 (11,4V 3760mAh) VGP-BPS33-15 (ang.)
Korean 78 Keys Wireless Keyboard Bluetooth Ultra Slim for iPad/Windows OS/Mac/Android (ang.)
4.0m OMEGA K-TYPE Thermocouple TT-K-30-SLE
AMAOE 16 Pro Super Sharp Tweez (ang.)
900M-T-2C KINGBOX 936 pozbawiona lutowni termostatycznej głowy
AmScope 10X-20X LED (ang.) Binocular Stereo Microscope Boom Arm + LED (ang.) Gooseneck
SN63/Pb37 MECHANIC HX-T100 (ang.)
